"The SMT production floor utilizes full inline automated
assembly."
Surface Mount
Department
Each SMT production line is an integrated process that includes solder
paste deposition, high speed chip shooters, universal and fine pitch component
placer's and reflow ovens. Some lines are additionally equipped with glue dot
dispensers. Fine pitch capabilities include Vision printing down to 5 mil lines
and placement of 12 mil lead pitch devices.
![[Picture]](http://www.futronixinc.com/images/smt_full.gif)
Click here to take the SMT Tour |
| Futronix Inc. has
developed a process that allows through hole components to be inserted and
soldered along with SMT components of assemblies that would normally require
many individual process steps. This 'single point processing' approach provides
consistency yielding higher quality, lower cost and quicker turn around.
See Intrusive
Reflow Description |
|
SMT
Manufacturing Capabilities:
0402
Chip, 12 Mil Pitch FQFP
BGA
& Micro BGA
Fuji
CP6 and IP2
Double
Sided and Intrusive Reflow
No-Clean
or Aqueous Process
Chip-on-Board
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Registrant:
Prime
Government Contractor
DUNS# 620844233
Registrant:
Government Contractors Association
|
